25TTS12 controllo di fase semiconduttori 1200 V
$0.252000-99999 Piece/Pieces
$0.22≥100000Piece/Pieces
Tipo di pagamento: | L/C,T/T,Paypal |
Incoterm: | FOB,CFR,CIF |
Quantità di ordine minimo: | 2000 Piece/Pieces |
Trasporti: | Ocean,Air |
Porta: | SHANGHAI |
$0.252000-99999 Piece/Pieces
$0.22≥100000Piece/Pieces
Tipo di pagamento: | L/C,T/T,Paypal |
Incoterm: | FOB,CFR,CIF |
Quantità di ordine minimo: | 2000 Piece/Pieces |
Trasporti: | Ocean,Air |
Porta: | SHANGHAI |
Modello: YZPST-25TTS12-1
marchio: YZPST
Unità vendibili | : | Piece/Pieces |
Tipo pacchetto | : | 1. Imballaggio anti-elettrostatico 2. Scatola di cartone 3. Imballaggio protettivo in plastica |
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Phase Control SCR, 25 A
DESCRIZIONE / CARATTERISTICHE
I 25TTS ... High Voltage Series di raddrizzatori controllati al silicio sono progettati specificamente per applicazioni di commutazione di potenza e controllo di fase di media potenza. La tecnologia di passivazione del vetro utilizzata ha un funzionamento affidabile fino a
125 ° C temperatura di giunzione.
Le applicazioni tipiche sono in rettifica di input (avvio graduale) e questi prodotti sono progettati per essere utilizzati con diodi di ingresso Vishay HPP, interruttori e raddrizzatori di uscita disponibili in identici contorni del pacchetto.
Questo prodotto è stato progettato e qualificato per il livello industriale.
PRODUCT SUMMARY |
|
VT at 16 A |
< 1.25 V |
ITSM |
300 A |
VRRM |
800/1200 V |
OUTPUT CURRENT IN TYPICAL APPLICATIONS |
|||
APPLICATIONS |
SINGLE-PHASE BRIDGE |
THREE-PHASE BRIDGE |
UNITS |
Capacitive input filter TA = 55 °C, TJ = 125 °C, common heatsink of 1 °C/W |
18 |
22 |
A |
MAJOR RATINGS AND CHARACTERISTICS |
|||
PARAMETER |
TEST CONDITIONS |
VALUES |
UNITS |
IT(AV) |
Sinusoidal waveform |
16 |
A |
IRMS |
|
25 |
|
VRRM/VDRM |
|
800/1200 |
V |
ITSM |
|
300 |
A |
VT |
16 A, TJ = 25 °C |
1.25 |
V |
dV/dt |
|
500 |
V/µs |
dI/dt |
|
150 |
A/µs |
TJ |
|
- 40 to 125 |
°C |
VOLTAGE RATINGS |
|||
PART NUMBER |
VRRM, MAXIMUM PEAK REVERSE VOLTAGE V |
VDRM, MAXIMUM PEAK DIRECT VOLTAGE V |
IRRM/IDRM AT 125 °C mA |
25TTS08 |
800 |
800 |
10 |
25TTS12 |
1200 |
1200 |
ABSOLUTE MAXIMUM RATINGS |
||||||
PARAMETER |
SYMBOL |
TEST CONDITIONS |
VALUES |
UNITS |
||
TYP. |
MAX. |
|||||
Maximum average on-state current |
IT(AV) |
TC = 93 °C, 180° conduction half sine wave |
16 |
A |
||
Maximum RMS on-state current |
IRMS |
|
25 |
|||
Maximum peak, one-cycle, non-repetitive surge current |
ITSM |
10 ms sine pulse, rated VRRM applied |
300 |
|||
10 ms sine pulse, no voltage reapplied |
350 |
|||||
Maximum I2t for fusing |
I2t |
10 ms sine pulse, rated VRRM applied |
450 |
A2s |
||
10 ms sine pulse, no voltage reapplied |
630 |
|||||
Maximum I2√t for fusing |
I2√t |
t = 0.1 to 10 ms, no voltage reapplied |
6300 |
A2√s |
||
Maximum on-state voltage drop |
VTM |
16 A, TJ = 25 °C |
1.25 |
V |
||
On-state slope resistance |
rt |
TJ = 125 °C |
12.0 |
mΩ |
||
Threshold voltage |
VT(TO) |
1.0 |
V |
|||
Maximum reverse and direct leakage current |
IRM/IDM |
TJ = 25 °C |
VR = Rated VRRM/VDRM |
0.5 |
mA |
|
TJ = 125 °C |
10 |
|||||
Holding current |
IH |
Anode supply = 6 V, resistive load, initial IT = 1 A |
- |
100 |
||
Maximum latching current |
IL |
Anode supply = 6 V, resistive load |
200 |
|||
Maximum rate of rise of off-state voltage |
dV/dt |
|
500 |
V/µs |
||
Maximum rate of rise of turned-on current |
dI/dt |
|
150 |
A/µs |
TRIGGERING |
||||
PARAMETER |
SYMBOL |
TEST CONDITIONS |
VALUES |
UNITS |
Maximum peak gate power |
PGM |
|
8.0 |
W |
Maximum average gate power |
PG(AV) |
|
2.0 |
|
Maximum peak positive gate current |
+ IGM |
|
1.5 |
A |
Maximum peak negative gate voltage |
- VGM |
|
10 |
V |
Maximum required DC gate current to trigger |
IGT |
Anode supply = 6 V, resistive load, TJ = - 10 °C |
60 |
mA |
Anode supply = 6 V, resistive load, TJ = 25 °C |
45 |
|||
Anode supply = 6 V, resistive load, TJ = 125 °C |
20 |
|||
Maximum required DC gate voltage to trigger |
VGT |
Anode supply = 6 V, resistive load, TJ = - 10 °C |
2.5 |
V |
Anode supply = 6 V, resistive load, TJ = 25 °C |
2.0 |
|||
Anode supply = 6 V, resistive load, TJ = 125 °C |
1.0 |
|||
Maximum DC gate voltage not to trigger |
VGD |
TJ = 125 °C, VDRM = Rated value |
0.25 |
|
Maximum DC gate current not to trigger |
IGD |
2.0 |
mA |
SWITCHING |
||||
PARAMETER |
SYMBOL |
TEST CONDITIONS |
VALUES |
UNITS |
Typical turn-on time |
tgt |
TJ = 25 °C |
0.9 |
µs |
Typical reverse recovery time |
trr |
TJ = 125 °C |
4 |
|
Typical turn-off time |
tq |
110 |
THERMAL AND MECHANICAL SPECIFICATIONS |
|||||
PARAMETER |
SYMBOL |
TEST CONDITIONS |
VALUES |
UNITS |
|
Maximum junction and storage temperature range |
TJ, TStg |
|
- 40 to 125 |
°C |
|
Maximum thermal resistance, junction to case |
RthJC |
DC operation |
1.1 |
°C/W |
|
Maximum thermal resistance, junction to ambient |
RthJA |
|
62 |
||
Typical thermal resistance, case to heatsink |
RthCS |
Mounting surface, smooth and greased |
0.5 |
||
Approximate weight |
|
|
2 |
g |
|
0.07 |
oz. |
||||
Mounting torque |
minimum |
|
|
6 (5) |
kgf · cm (lbf · in) |
maximum |
|
|
12 (10) |
||
Marking device |
|
Case style TO-220AB |
25TTS08 |
||
25TTS12 |
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